The
motherboard is the main circuit board inside the PC
which holds the processor, memory and
expansion slots and connects directly or indirectly
to every part of the PC. It's made up of a
chipset (known as the "glue logic"), some code in
ROM
and the various interconnections or
buses.
PC designs today use many different buses to link their
various components. Wide, high-speed buses are difficult
and expensive to produce: the signals travel at such a
rate that even distances of just a few centimeters cause
timing problems, while the metal tracks on the circuit
board act as miniature radio antennae, transmitting
electromagnetic
noise that introduces interference with signals
elsewhere in the system. For these reasons, PC design
engineers try to keep the fastest buses confined to the
smallest area of the motherboard and use slower, more
robust buses, for other parts.
This section focuses on basic functionality and
layout - the motherboard's various interfaces, buses and
chipsets being covered elsewhere.
Evolution
The original PC had a minimum of integrated devices,
just ports for a keyboard and a cassette deck (for
storage). Everything else, including a display adapter
and floppy or hard disk controllers, were add-in
components, connected via
expansion slots.
Over time, more devices have been integrated into the
motherboard. It's a slow trend though, as
I/O
ports and
disk controllers were often mounted on expansion
cards as recently as 1995. Other components - typically
graphics, networking,
SCSI
and sound - usually remain separate. Many manufacturers
have experimented with different levels of integration,
building in some or even all of these components.
However, there are drawbacks. It's harder to upgrade the
specification if integrated components can't be removed,
and highly integrated motherboards often require
non-standard cases. Furthermore, replacing a single
faulty component may mean buying an entire new
motherboard.
Consequently, those parts of the system whose
specification changes fastest - RAM, CPU and graphics -
tend to remain in sockets or slots for easy replacement.
Similarly, parts that not all users need, such as
networking or SCSI, are usually left out of
the base specification to keep costs down.
The basic changes in motherboard form factors over
the years are covered later in this section - the
diagrams below provide a detailed look at the various
components on two motherboards. The first a
Baby AT design, sporting the ubiquitous
Socket 7 processor connector, circa 1995. The second
is an
ATX design, with a Pentium II
Slot 1 type processor connector, typical of
motherboards on the market in late 1998.


Motherboard development consists largely of isolating
performance-critical components from slower ones. As
higher speed devices become available, they are linked
by faster buses - and the lower-speed buses are
relegated to supporting roles. In the late 1990s there
was also trend towards putting peripherals designed as
integrated chips directly onto the motherboard.
Initially this was confined to audio and video chips -
obviating the need for separate sound or graphics
adapter cards - but in time the peripherals integrated
in this way became more diverse and included items such
as
SCSI,
LAN
and even
RAID
controllers. While there are cost benefits to this
approach the biggest downside is the restriction of
future upgrade options.
BIOS
All motherboards include a small block of Read Only
Memory (ROM)
which is separate from the main system memory used for
loading and running software. The ROM contains the PC's
Basic Input/Output System (BIOS).
This offers two advantages: the code and data in the ROM
BIOS need not be reloaded each time the computer is
started, and they cannot be corrupted by wayward
applications that write into the wrong part of memory. A
Flash upgradeable BIOS may be updated via a
floppy diskette to ensure future compatibility with
new chips, add-on cards etc.
The BIOS comprises several separate routines, serving
different functions. The first part runs as soon as the
machine is powered on. It inspects the computer to
determine what hardware is fitted and then conducts some
simple tests to check that everything is functioning
normally - a process called the power-on self test (POST).
If any of the peripherals are plug and play devices,
it's at this point that the BIOS assigns their
resources. There's also an option to enter the Setup
program. This allows the user to tell the PC what
hardware is fitted, but thanks to automatic
self-configuring BIOSes this isn't used so much now.
If all the tests are passed, the ROM then tries to
determine which drive to
boot the machine from. Most PCs ship with the BIOS
set to check for the presence of an operating system in
the
floppy disk drive first (A:), then on the primary
hard disk drive. Any modern BIOS will allow the floppy
drive to be moved down the list so as to reduce normal
boot time by a few seconds. To accommodate PCs that ship
with a bootable CD-ROM, some BIOSes allow the
CD-ROM drive to be assigned as the boot drive. Some
also allow booting from a hard disk drive other than the
primary
IDE
drive. In this case it would be possible to have
different operating systems - or separate instances of
the same OS - on different drives. Many BIOSes allow the
start-up process to be interrupted to specify the first
boot device without actually having to enter the BIOS
setup utility itself. If no bootable drive is detected,
a message is displayed indicating that the system
requires a system disk. Once the machine has booted, the
BIOS serves a different purpose by presenting DOS with a
standardised
API
for the PC hardware. In the days before Windows, this
was a vital function, but 32-bit "protect mode" software
doesn't use the BIOS, so again it's of less benefit
today.
Windows 98 (and later) provides multiple display
support. Since most PCs have only a single
AGP
slot, users wishing to take advantage of this will
generally install a second graphics card in a
PCI
slot. In such cases, most BIOSes will treat the PCI card
as the main graphics card by default. Some, however,
allow either the AGP card or the PCI card to be
designated as the primary graphics card.
Whilst the PCI interface has helped - by allowing
IRQs
to be shared more easily - the limited number of IRQ
settings available to a PC remains a problem for many
users. For this reason, most BIOSes allow ports that are
not in use to be disabled. With the increasing
popularity of cable and
ADSL
Internet connections and the
ever-increasing availability of peripherals that use the
USB
interface, it will often be possible to get by without
needing either a serial or a parallel port.
CMOS RAM
Motherboards also include a separate block of memory
made from very low power consumption
CMOS (complementary metal oxide silicon) RAM chips,
which is kept "alive" by a battery even when the PC's
power is off. This is used to store basic information
about the PC's configuration: number and type of hard
and floppy drives, how much memory, what kind and so on.
All this used to be entered manually, but modern
auto-configuring
BIOSes do much of this work, in which case the more
important settings are advanced settings such as DRAM
timings. The other important data kept in CMOS memory is
the time and date, which is updated by a Real Time Clock
(RTC). The clock, CMOS RAM and battery are usually all
integrated into a single chip. The PC reads the time
from the RTC when it
boots up, after which the CPU keeps time - which is
why system clocks are sometimes out of sync. Rebooting
the PC causes the RTC to be reread, increasing their
accuracy.
EFI
The BIOS has evolved very little since the birth of the
PC in 1981, remaining a chunk of hand-crafted assembly
language code most users know only for the series of
arcane configuration and test messages fleetingly
displayed when they turn on their PC.
Intel first signalled that all that was about to
change in early 2000, with the release of the first
version of its Extensible Firmware Interface (EFI)
specification, a proposed standard for the architecture,
interface and services of a brand new type of PC
firmware, designed to provide a well-specified set of
services that are consistent across all platforms.
EFI services are divided into two distinct groups,
those that are available only before the operating
system is loaded, known as "Boot Services," and those
that are also available after EFI has assumed its
minimum footprint configuration, known as "Runtime
Services." Boot Services provide the breadth of
functionality offered by EFI for platform configuration,
initialisation, diagnostics, OS kernel image loading and
other functions. Run-time Services represent a minimum
set of services primarily used to query and update
non-volatile EFI settings.
Services within EFI are officially specified in the
EFI Specification as core services and protocol
interfaces. Various protocol interfaces have been
defined for access to a variety of boot devices, many of
which are provided in the EFI reference implementation.
Other protocol interfaces provide services for
application level functions, such as memory allocation
and obtaining access to a specified protocol interface.
EFI modules are generally defined as applications or
drivers. Drivers conform to a model defined in the EFI
specification, and are used to implement a particular
protocol interface. In many cases the implementation of
one protocol interface may use or enhance the
functionality of an existing protocol interface, thereby
providing a mechanism for an object oriented design
practice called containment and aggregation.
In essence, EFI is effectively a tiny operating
system in its own right, complete with its own basic
networking, graphics, keyboard and storage handling
software. This will allow it to have a radically
different user interface to what we've been accustomed
to, with support for high resolution displays and a
proper GUI. The differences are far more than cosmetic
though.
Since EFI is able to manage its own storage space -
normally envisioned as a partition on a hard disk -
hardware manufacturers will be able to add many more
diagnostic and control options, and include support for
different kinds of computer systems and configurations,
without being constrained by the cost of expensive
onboard flash memory. Moreover, the fact
that EFI is developed in a high-level programming
language will also spur innovation, allowing additional
features to be created using standard programming tools.
Such additions can include much more detailed and useful
diagnostics, self-configuration programs and ways to
sort out problems even if the operating system has died.
Since it has its own networking capability, EFI will
also be able to support remote diagnostics.
The EFI specification is primarily intended for the
next generation of IA-32 and Itanium architecture-based
computers, and is an outgrowth of the "Intel Boot
Initiative" (IBI) program that began in 1998.
Form factor
Early PCs used the AT
form factor and 12in wide motherboards. The sheer
size of an AT motherboard caused problems for upgrading
PCs and did not allow use of the increasingly popular
slimline desktop cases. These problems were largely
addressed by the smaller version of the full AT form
factor, the Baby AT, introduced in 1989. Whilst this
remains a common form factor, there have been several
improvements since. All designs are open standards and
as such don't require certification. A consequence is
that there can be some quite wide variation in design
detail between different manufacturers' motherboards.
BAT
The Baby AT (BAT)
format reduced the dimensions of the motherboard
to a typical 9in wide by 10in long, and BAT
motherboards are generally characterised by
their shape, an AT-style keyboard connector
soldered to the board and serial and parallel
port connectors which are attached using cables
between the physical ports mounted on the system
case and corresponding connectors located on the
motherboard.
With the BAT design the processor socket is
located at the front of the motherboard, and
full-length expansion cards are intended to
extend over it. This means that removing the
processor requires the removal of some or all
expansion cards first. Problems were exacerbated
by the increasing speeds of Pentium-class
processors. System cooling relied on the AT
power supply blowing air out of the chassis
enclosure and, due to the distance between the
power supply and the CPU, an additional chassis
fan or active heatsink became a necessity to
maintain good airflow across the CPU. AT power
supplies only provide 12V and 5V outputs to the
motherboard, requiring additional regulators on
the motherboard if 3.3V components (PCI cards or
CPUs) are used. Sometimes a second heatsink was
also required on these voltage regulators and
together the various additional heat dissipation
components caused serious obstruction for
expansion slots.
Some BAT designs allow the use of either AT
or ATX power supplies, and some ATX cases might
allow the use of a Baby-AT motherboard.
|
LPX
The LPX format is a specialised variant of the
Baby-AT used in low profile desktop systems and
is a loose specification with a variety of
proprietary implementations.
Expansion slots are located on a central
riser card, allowing cards to be mounted
horizontally. However, this arrangement can make
it difficult to remove the motherboard, and the
more complex engineering required adds to system
costs. As the riser card prevents good airflow
within the system case, additional chassis fans
are almost always needed.
|
ATX
The Intel Advanced/ML motherboard, launched in
1996, was designed to solve these issues and
marked the beginning of a new era in motherboard
design. Its size and layout are completely
different to the BAT format, following a new
scheme known as
ATX. The dimensions of a standard ATX board
are 12in wide by 9.6in long; the mini ATX
variant is typically of the order 11.2in by
8.2in.
The ATX design gets round the problem by moving
the CPU socket and the voltage regulator to the
right-hand side of the expansion bus. Room is
made for the CPU by making the card slightly
wider, and shrinking or integrating components
such as the Flash BIOS,
I/O logic and keyboard controller. This
means the board need only be half as deep as a
full size Baby AT, and there's no obstruction
whatsoever to the six expansion slots (two ISA,
one ISA/PCI, three PCI).
The ATX uses a new specification of power
supply that can be powered on or off by a signal
from the motherboard. This allows notebook-style
power management and software-controlled
shutdown and power-up. A 3.3V output is also
provided directly from the power supply.
Accessibility of the processor and memory
modules is improved dramatically, and relocation
of the peripheral connectors allows shorter
cables to be used. This also helps reduce
electromagnetic interference. The ATX power
supply has a side vent that blows air from the
outside directly across the processor and memory
modules, allowing passive heatsinks to be used
in most cases, thereby reducing system noise.
Mini-ATX is simply a smaller version of a
full-sized ATX board. On both designs,
parallel,
serial,
PS/2 keyboard and mouse ports are located on
a double-height I/O shield at the rear. Being
soldered directly onto the board generally means
no need for cable interconnects to the on-board
I/O ports. A consequence of this, however, is
that the ATX needs a newly designed case, with
correctly positioned cut-outs for the ports, and
neither ATX no Mini-ATX boards can be used in
AT-style cases.
|
NLX
Intel's
NLX design, introduced in 1997, is an
improvement on the LPX design for low-profile
systems, with an emphasis on ease of
maintenance. The NLX format is smaller,
typically 8.8in wide by 13in long, so well
suited for low-profile desktop cases.
All expansion slots, power cables and
peripheral connectors are located on an
edge-mounted riser card, allowing simple removal
of the main motherboard, which is mounted on
rails in the chassis. It uses a full-width I/O
shield to allow for different combinations of
rear-panel I/O. The design allows for use of an
AGP card, but the slot must be on the
motherboard, which reduces the ease of
maintenance when such a card is implemented.
|
MicroATX
Introduced in the late 1990s, the MicroATX is
basically a smaller version of Intel's ATX
specification, intended for compact, low-cost
consumer systems with limited expansion
potential.
The maximum size of the board is 9.6in
square, and its designed to fit into either a
standard ATX case or one of the new micro-tower
desktop designs. The double-decker I/O shield is
the same as that on the ATX design, but there's
only provision for up to four expansion slots as
opposed to the seven that ATX allows. The
microATX also allows use of a smaller power
supply, such as the SFX design, which is reduced
in both size and power output.
|
FlexATX
The FlexATX is a natural evolution of the
Intel's microATX form factor which was first
unveiled in late 1999. The FlexATX addendum to
the microATX specification addresses the
requirements of only the motherboard and not the
overall system solution. As such, it
does not detail the interfaces, memory or
graphics technologies required to develop a
successful product design. These are left to the
implementer and system designer. The choice of
processor is, however, limited to socket-only
designs.The principal difference between
FlexATX and microATX is that the new form factor
reduces the size of the motherboard - to 9in x
7.5in. Not only does this result in lower
overall system costs, it also facilitates
smaller system designs. The FlexATX form factor
is backwards compatible with both the ATX and
micro-ATX specifications - use of the same
motherboard mounting holes as both of its
predecessors avoids the need to retool existing
chassis.
In the spring of 2000 VIA Technologies
announced an even smaller motherboard than the
FlexATX. At 8.5in x 7.5in, the company's ITX
form factor is half and inch less wide than it's
Intel competitor. The key innovation that allows
the ITX to achieve such a compact form is the
specially designed slimline power unit with
built in fan. It's dimensions of 174mm long x
73mm wide x 55mm high compare with a standard
ATX power supply unit measuring 140mm x 150mm x
86mm.
The table below compares the dimensions of
the microATX, FlexATX and ITX form factors:
|
Form
Factor |
Max.
Width (mm) |
Max.
Depth (mm) |
|
microATX |
244 |
244 |
|
FlexATX |
229 |
191 |
|
ITX |
215 |
191 |
Unsurprisingly Intel's
FlexATX form factor uses it's
CNR riser architecture, while the ITX uses
the rival
ACR architecture. |
Riser architectures
In the late 1990s, the PC industry developed a need for
a riser architecture that would contribute towards
reduced overall system costs and at the same time
increase the flexibility of the system manufacturing
process. The Audio/Modem Riser (AMR)
specification, introduced in the summer of 1998, was the
beginning of a new riser architecture approach. AMR had
the capability to support both audio and modem
functions. However, it did have some shortcomings, which
were identified after the release of the specification.
These shortcomings included the lack of Plug and Play (PnP)
support, as well as the consumption of a
PCI
connector location.
Consequently, new riser architecture specifications
were defined which combine more functions onto a single
card. These new riser architectures combine audio,
modem,
broadband technologies, and
LAN
interfaces onto a single card. They continue to give
motherboard
OEMs
the flexibility to create a generic motherboard for a
variety of customers. The riser card allows OEMs and
system integrators to provide a customised solution for
each customer's needs. Two of the most recent riser
architecture specifications include CNR and ACR.
Intel's CNR (Communication and Networking Riser)
specification defines a hardware scalable
OEM
motherboard riser and interface that supports the audio,
modem, and LAN interfaces of core logic chipsets. The
main objective of this specification is to reduce the
baseline implementation cost of features that are widely
used in the "Connected PC", while also addressing
specific functional limitations of today's audio, modem,
and
LAN subsystems.
PC users' demand for feature-rich PCs, combined with
the industry's current trend towards lower cost,
mandates higher levels of integration at all levels of
the PC platform. Motherboard integration of
communication technologies has been problematic to date,
for a variety of reasons, including
FCC
and international telecom certification processes,
motherboard space, and other manufacturer specific
requirements.
Motherboard integration of the audio, modem, and LAN
subsystems is also problematic, due to the potential for
increased noise, which in-turn degrades the performance
of each system. The CNR specifically addresses these
problems by physically separating these noise-sensitive
systems from the noisy environment of the motherboard.
With a standard riser solution, as defined in this
specification, the system manufacturer is free to
implement the audio, modem, and/or LAN subsystems at a
lower bill of materials (BOM) cost than would be
possible by deploying the same functions in
industry-standard expansion slots or in a proprietary
method. With the added flexibility that hardware
scalability brings, a system manufacturer has several
motherboard acceleration options available, all stemming
from the baseline CNR interface.
The CNR Specification supports the five interfaces:
 |
AC97 Interface - Supports audio and modem
functions on the CNR card
|
 | LAN Connect Interface (LCI) - Provides 10/100
LAN or Home Phoneline Networking capabilities for
Intel chipset based solutions
|
 | Media Independent Interface (MII) - Provides
10/100 LAN or Home Phoneline Networking capabilities
for CNR platforms using the MII Interface
|
 | Universal Serial Bus
(USB) - Supports new or emerging technologies
such as
xDSL or wireless
|
 | System Management Bus (SMBus) - Provides Plug
and Play
(PnP) functionality on the CNR card. |
Each CNR card can utilise a maximum of four
interfaces by choosing the specific LAN interface to
support.
The rival ACR specification is supported by an alliance
of leading computing and communication companies, whose
founders include 3COM,
AMD, VIA Technologies and Lucent
Technologies. Like CNR, it defines a form factor and
interfaces for multiple and varied communications and
audio subsystem designs in desktop
OEM
personal computers. Building on first generation PC
motherboard riser architecture, ACR expands the riser
card definition beyond the limitation of audio and modem
codecs, while maintaining backward compatibility with
legacy riser designs through an industry standard
connector scheme. The ACR interface combines several
existing communications buses, and introduces new and
advanced communications buses answering industry demand
for low-cost, high-performance communications
peripherals.
ACR supports modem, audio,
LAN,
and
xDSL. Pins are reserved for future wireless bus
support. Beyond the limitations of first generation
riser specifications, the ACR specification enables
riser-based broadband communications, networking
peripheral and audio subsystem designs. ACR accomplishes
this in an open-standards context.
Like the original AMR Specification, the ACR
Specification was designed to occupy or replace an
existing
PCI
connector slot. This effectively reduces the number of
available PCI slots by one, regardless of whether the
ACR connector is used. Though this may be acceptable in
a larger form factor motherboard, such as
ATX,
the loss of a PCI connector in a microATX or FlexATX
motherboard - which often provide as few as two
expansion slots - may well be viewed as an unacceptable
trade-off. The CNR specification overcomes this issue by
implementing a shared slot strategy, much like the
shared
ISA
/PCI slots of the recent past. In a shared slot
strategy, both the CNR and PCI connectors effectively
use the same I/O bracket space. Unlike the ACR
architecture, when the system integrator chooses not to
use a CNR card, the shared PCI slot is still available.
Although the two specifications both offer similar
functionality, the way in which they are implemented are
quite dissimilar. In addition to the PCI
connector/shared slot issue, the principal differences
are as follows:
 | ACR is backwards compatible with AMR, CNR isn't
|
 | ACR provides support
xDSL technologies via its Integrated Packet Bus
(IPB) technology; CNR provides such support via the
well-established
USB interface
|
 | ACR provides for concurrent support for LCI (LAN
Connect Interface) and MII (Media Independent
Interface) LAN interfaces; CNR supports either, but
not both at the same time
|
 | The ACR Specification has already reserved pins
for a future wireless interface; the CNR
specification has the pins available but will only
define them when the wireless market has become more
mature. |
Ultimately, motherboard manufacturers are going to
have to decide whether the ACR specification's
additional features are worth the extra cost.
CPU interfaces
The PC's ability to evolve many different interfaces
allowing the connection of many different classes of
add-on component and peripheral device has been one of
the principal reasons for its success. The key to this
has been standardisation, which has promoted competition
and, in turn, technical innovation.
The heart of a PC system - the processor - is no
different in this respect than any other component or
device. Intel's policy in the early 1990s of producing
OverDrive CPUs that were actually designed for
upgrade purposes required that the interface by which
they were connected to the motherboard be standardised.
A consequence of this is that it enabled rival
manufacturers to design and develop processors that
would work in the same system. The rest is history.
In essence, a CPU is a flat square sliver of silicon
with circuits etched on its surface. This chip is linked
to connector pins and the whole contraption encased some
form of packaging - either ceramic or plastic - with
pins running along the flat underside or along one edge.
The CPU package is connected to a motherboard via some
form of CPU interface, either a slot or a socket. For
many years the socket style of CPU was dominant. Then
both major PC chip manufacturers switched to a slot
style of interface. After a relatively short period of
time they both changed their minds and the socket was
back in favour!
The older 386, 486, classic Pentium and Pentium
MMX
processors came in a flat square package with an array
of pins on the underside - called Pin Grid Array (PGA)
- which plugged into a socket-style CPU interface on the
motherboard. The earliest such interface for which many
motherboards and working systems remain to this day -
not least because it supported CPUs from so many
different chip manufacturers - is Socket 7. Originally
developed by Intel as the successor to Socket 5, it was
the same size but had different electrical
characteristics including a
system bus that ran at 66MHz. Socket 7 was the
interface used by most Pentium systems from the 75MHz
version and beyond.
Socket 8 was developed for Intel's Pentium Pro CPU -
introduced in late 1995 - and specifically to handle its
unusual dual-cavity, rectangular package. To accommodate
L2 cache - in the package but not on the core - this
contained up to three separate
dice
mounted on a small circuit board. The complicated
arrangement proved extremely expensive to manufacture
and was quickly abandoned.
With the introduction of their Pentium II CPU, Intel
switched to a much cheaper solution for packaging chips
that consisted of more than a single die. Internally,
the
SECC package was really a circuit board containing
the core processor chip and cache memory chips. The
cartridge had pins running along one side which enabled
it to be mounted perpendicularly to the motherboard - in
much the same way as the graphics or sound card is
mounted into an expansion slot - into an interface that
was referred to as Slot 1. The up to two 256KB L2 cache
chips ran at half the CPU speed. When Intel reverted -
from the Pentium III Coppermine core - to locating L2
cache on the processor die, they continued to use
cacheless Slot 1 packaging for a while for reasons of
compatibility.
Pentium II Xeon's - unlike their desktop counterparts
- ran their L2 cache at full clock speed. This
necessitated a bigger
heatsink which in turn required a taller cartridge.
The solution was Slot 2, which also sported more
connectors than Slot 1, to support a more aggressive
multi-processor
protocol amongst other features.
When Intel stopped making its MMX processor in
mid-1998 it effectively left the Socket 7 field entirely
to its competitors, principally AMD and Cyrix. With the
co-operation of both motherboard and chipset
manufacturers their ambitious plans for extending the
life of the
"legacy" form factor was largely successful.
AMD's determination to match Intel's proprietary Slot
1 architecture on Socket 7 boards was amply illustrated
by their 0.25-micron K6-2 processor, launched at the end
of May 1998, which marked a significant development of
the architecture. AMD referred to this as the "Super7"
platform initiative, and its aim was to keep the
platform viable throughout 1999 and into the year 2000.
Developed by AMD and key industry partners, the Super7
platform supercharged Socket 7 by adding support for
100MHz and 95MHz bus interfaces and the Accelerated
Graphics Port (AGP)
specification and by delivering other leading-edge
features, including 100MHz
SDRAM,
USB,
Ultra DMA and
ACPI.
When AMD introduced their Athlon processor in
mid-1999 they emulated Intel's move away from a
socket-based CPU interface in favour of a slot-based CPU
interface, in their case "Slot A". This was physically
identical to Slot 1, but it communicated across the
connector using a completely different protocol -
originally created by Digital and called EV6 - which
allowed RAM to CPU transfers via a 200MHz
FSB.
Featuring an SECC slot with 242 leads, Slot A used a
Voltage Regulator Module (VRM),
putting the onus on the CPU to set the correct operating
voltage - which in the case of Slot A CPUs was a range
between 1.3V and 2.05V.
Slot-based processors are overkill for single-chip
dies. Consequently, in early 1999 Intel moved back to a
square
PGA
packaging for its single die, integrated L2 cache,
Celeron range of CPUs. Specifically these used a PPGA
370 packaging, which connected to the motherboard via a
Socket 370 CPU interface. This move marked the beginning
of Intel's strategy for moving its complete range of
processors back to a socket-based interface. Socket 370
has proved to be one of the more enduring socket types,
not least because of the popularity of the cheap and
overclockable Celeron range. Indeed, Intel is not the
only processor manufacturer which produces CPUs that
require Socket 370 - the Cyrix MIII (VIA C3) range also
utilising it.
The sudden abandonment of Slot 1 in favour of Socket
370 created a need for adapters to allow PPGA-packaged
CPUs to be used in Slot 1 motherboards. Fortunately, the
industry responded, with Abit being the first off the
mark with its original "SlotKET" adapter. Many were soon
to follow, ensuring that Slot 1 motherboard owners were
not left high and dry. A Slot 1 to Socket 370 converter
that enables Socket 370-based CPUs to be plugged into a
Slot 1 motherboard was also produced. Where required,
these converters don't just provide the appropriate
connector, they also make provision for voltage
conversion.
Unfortunately users were more inconvenienced by
Intel's introduction of the FC-PGA (Flip Chip-Pin Grid
Array) and FC-PGA2 variants of the Socket 370 interface
- for use with Pentium III Coppermine and Tualatin CPUs
respectively - some time later. The advantage with this
packaging design is that the hottest part of the chip is
located on the side that is away from the motherboard,
thereby improving heat dissipation. The FC-PGA2 package
adds an Integral Heat Spreader, improving heat
conduction still further. Whilst FC-PGA and FC-PGA2 are
both mechanically compatible with Socket 370,
electrically they're incompatible and therefore require
different motherboards. Specifically, FC-PGA processors
require motherboards that support VRM 8.4 specifications
while FC-PGA2 processors require support for the later
VRM 8.8 specifications.
Like Intel's Slot 1, AMD's proprietary Slot A
interface was also to prove to be relatively
short-lived. With the advent of the Athlon Thunderbird
and Spitfire cores, the chipmaker followed the lead of
the industry leader by also reverting to a PPGA-style
packaging for its new family of Athlon and Duron
processors. This connects to a motherboard via what AMD
calls a "Socket A" interface. This has 462 pin holes -
of which 453 are used by the CPU - and supports both the
200MHz EV6 bus and newer 266MHz EV6 bus. AMD's
subsequent Palomino and Morgan cores are also Socket A
compliant.
With the release of the Pentium 4 in late 2000, Intel
introduced yet another socket to its line-up, namely
Socket 423. Indicative of the trend for processors to
consume ever decreasing amounts of power, the PGA-style
Socket 423 has a VRM operational range of between 1.0V
and 1.85V.
Socket 423 had been in use for only a matter of
months when Intel muddied the waters still further with
the announcement of the new Socket 478 form factor. The
principal difference between this and its predecessor is
that the newer format socket features a much more
densely packed arrangement of pins known as a micro Pin
Grid Array (µPGA) interface, which allows both the size
of the CPU itself and the space occupied by the
interface socket on the motherboard to be significantly
reduced. Socket 478 was introduced to accommodate the
0.13-micron Pentium 4 Northwood core, launched at the
beginning of 2002.
The table below identifies all the major CPU
interfaces from the time of Intel's Socket 1, the first
"OverDrive"
socket used by Intel's 486 processor in the early 1990s:
|
Name |
Interface |
Description |
|
Socket 1 |
169-pin |
Found on 486
motherboards, operated at 5 volts and
supported 486 chips, plus the DX2, DX4
OverDrive. |
|
Socket 2 |
238-pin |
A minor upgrade from
Socket 1 that supported all the same chips.
Additionally supported a Pentium OverDrive. |
|
Socket 3 |
237-pin |
Operated at 5 volts,
but had the added capability of operating at
3.3 volts, switchable with a jumper setting
on the motherboard. Supported all of the
Socket 2 chips with the addition of the
5x86. Considered the last of the 486
sockets. |
|
Socket 4 |
273-pin |
The first socket
designed for use with Pentium class
processors. Operated at 5 volts and
consequently supported only the low-end
Pentium-60/66 and the OverDrive chip.
Beginning with the Pentium-75, Intel moved
to the 3.3 volt operation. |
|
Socket 5 |
320-pin |
Operated at 3.3
volts and supported Pentium class chips from
75MHz to 133MHz. Not compatible with later
chips because of their requirement for an
additional pin. |
|
Socket 6 |
235-pin |
Designed for use
with 486 CPU's, this was an enhanced version
of Socket 3 supporting operation at 3.3
volts. Barely used since it appeared at a
time when the 486 was about to be superseded
by the Pentium. |
|
Socket 7 |
32-pin |
Introduced for the
Pentium MMX, the socket had provision for
supplying the split core/IO voltage required
by this and later chips. The interface used
for all Pentium clones with a 66MHz bus. |
|
Socket 8 |
387-pin |
Used exclusively by
the Intel Pentium Pro, the socket proved
extremely expensive to manufacture and was
quickly dropped in favour of a
cartridge-based design. |
|
Slot 1 |
242-way connector |
The circuit board
inside the package had up to 512KB of L1
cache on it - consisting of two 256KB chips
- which ran at half the CPU speed. Used by
Intel Pentium II, Pentium III and Celeron
CPUs. |
|
Slot 2 |
330-way connector |
Similar to Slot 1,
but with the capacity to hold up to 2MB of
L2 cache running at the full CPU speed. Used
on Pentium II/III Xeon CPUs. |
|
Slot A |
242-way connector |
AMD interface
mechanically compatible with Slot 1 but
which using a completely different
electrical interface. Introduced with the
original Athlon CPU. |
|
Socket 370 |
370-pin |
Began to replace
Slot 1 on the Celeron range from early 1999.
Also used by Pentium III Coppermine and
Tualatin CPUs in variants known as FC-PGA
and FC-PGA2 respectively. |
|
Socket A |
462-pin |
AMD interface
introduced with the first Athlon processors
(Thunderbird) with on-die L2 cache.
Subsequently adopted throughout AMD's CPU
range. |
|
Socket 423 |
423-pin |
Introduced to
accommodate the additional pins required for
the Pentium 4's completely new FSB. Includes
an Integral Heat Spreader, which both
protects the die and provides a surface to
which large heat sinks can be attached. |
|
Socket 603 |
603-pin |
The connector for
Pentium 4 Xeon CPUs. The additional pins are
for providing more power to future CPUs with
large on-die (or even off-die) L3 caches,
and possibly for accommodating
inter-processor-communication signals for
systems with multiple CPUs. |
|
Socket 478 |
478-pin |
Introduced in
anticipation of the introduction of the
0.13-micron Pentium 4 Northwood CPU at the
beginning of 2002. It's micro Pin Grid Array
(µPGA) interface allows both the size of the
CPU itself and the space occupied by the
socket on the motherboard to be
significantly reduced. |